Your role

• hands-on development of applications for in-line metrology & inspection in semiconductor manufacturing by using ZEISS’ FIB-SEM technology

• be part of the engineering team and help development of FIB – SEM technology

• obtain first-hand knowledge of semiconductor FIB-SEM applications at customer sites and identify areas for improvement as well as new market opportunities

• work jointly & hands-on with internal hardware and software development groups

• provide technical guidance to Business Development Managers and sales team

• lead and perform customer (live) demos with customer samples and wafers

• interface with customers worldwide for application development and training activities

• attends and present at professional conferences

Your profile

• hands-on experience with SEM imaging and excellent understanding of the SEM imaging mechanisms

• experience with FIB-SEM sample preparation will be an advantage

• demonstrated ability in development of new processes or methodologies using FIB-SEM or SEM instruments

• experience in Design of Experiments (DOE) and Statistical Process Control (SPC)

• knowledge of coding in Python or any other programming language which can be used for data analytics or image processing is a big advantage

• excellent communication skills, self-direction, integrity, positive thinking, strong learning desires and good teamwork

• open to international travel and experience the work in semiconductor fabs (USA, S. Korea, Taiwan, China and Japan)

• Master or PhD Degree in Engineering, Material Science, Physics or Chemistry

• You should be able communicate freely in English. German knowledge is an advantage, but not mandatory

Your ZEISS Recruiting Team: